| 2008 |
|---|
| 7 | EE | Ki Jin Han,
Madhavan Swaminathan,
Ege Engin:
Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects.
DAC 2008: 421-424 |
| 6 | EE | Krishna Bharath,
Ege Engin,
Madhavan Swaminathan:
Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM.
DAC 2008: 560-565 |
| 2007 |
|---|
| 5 | EE | Krishna Bharath,
Ege Engin,
Madhavan Swaminathan,
Kazuhide Uriu,
Toru Yamada:
Computationally Efficient Power Integrity Simulation for System-on-Package Applications.
DAC 2007: 612-617 |
| 4 | EE | Mohit Pathak,
Souvik Mukherjee,
Madhavan Swaminathan,
Ege Engin,
Sung Kyu Lim:
Placement and routing of RF embedded passive designs in LCP substrate.
ICCD 2007: 273-279 |
| 3 | EE | Ege Engin,
Krishna Bharath,
Madhavan Swaminathan:
Analysis for Signal and Power Integrity Using the Multilayered Finite Difference Method.
ISCAS 2007: 1493-1496 |
| 2006 |
|---|
| 2 | EE | Rohan Mandrekar,
Krishna Bharath,
Krishna Srinivasan,
Ege Engin,
Madhavan Swaminathan:
System level signal and power integrity analysis methodology for system-in-package applications.
DAC 2006: 1009-1012 |
| 1 | EE | Krishna Srinivasan,
P. Muthana,
Rohan Mandrekar,
Ege Engin,
J. Choi,
Madhavan Swaminathan:
Enhancement of Signal Integrity and Power Integrity with Embedded Capacitors in High-Speed Packages.
ISQED 2006: 284-291 |
