| |
| 2004 | ||
|---|---|---|
| 3 | EE | William R. Mann, Frederick L. Taber, Philip W. Seitzer, Jerry J. Broz: The Leading Edge of Production Wafer Probe Test Technology. ITC 2004: 1168-1195 |
| 2000 | ||
| 2 | Jerry J. Broz, James C. Andersen, Reynaldo M. Rincon: Reducing device yield fallout at wafer level test with electrohydrodynamic (EHD) cleaning. ITC 2000: 477-484 | |
| 1999 | ||
| 1 | Jerry J. Broz, Reynaldo M. Rincon: Probe contact resistance variations during elevated temperature wafer test. ITC 1999: 396-405 | |
| 1 | James C. Andersen | [2] |
| 2 | William R. Mann | [3] |
| 3 | Reynaldo M. Rincon | [1] [2] |
| 4 | Philip W. Seitzer | [3] |
| 5 | Frederick L. Taber | [3] |