Reynaldo M. Rincon

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2000

2 Jerry J. Broz, James C. Andersen, Reynaldo M. Rincon: Reducing device yield fallout at wafer level test with electrohydrodynamic (EHD) cleaning. ITC 2000: 477-484

1999

1 Jerry J. Broz, Reynaldo M. Rincon: Probe contact resistance variations during elevated temperature wafer test. ITC 1999: 396-405

2000
2		Jerry J. Broz, James C. Andersen, Reynaldo M. Rincon: Reducing device yield fallout at wafer level test with electrohydrodynamic (EHD) cleaning. ITC 2000: 477-484
1999
1		Jerry J. Broz, Reynaldo M. Rincon: Probe contact resistance variations during elevated temperature wafer test. ITC 1999: 396-405

Coauthor Index

1 James C. Andersen [2]

2 Jerry J. Broz [1] [2]