| |
| 2005 | ||
|---|---|---|
| 1 | EE | E. Misra, Md M. Islam, Mahbub Hasan, H. C. Kim, T. L. Alford: Percolative approach for failure time prediction of thin film interconnects under high current stress. Microelectronics Reliability 45(2): 391-395 (2005) |
| 1 | T. L. Alford | [1] |
| 2 | Mahbub Hasan | [1] |
| 3 | H. C. Kim | [1] |
| 4 | E. Misra | [1] |