| |
| 2008 | ||
|---|---|---|
| 1 | EE | E. Jung, Andreas Ostmann, Peter Ramm, Jürgen Wolf, Michael Toepper, Maik Wiemer: Through Silicon Vias as Enablers for 3D Systems CoRR abs/0805.0918: (2008) |
| 1 | E. Jung | [1] |
| 2 | Andreas Ostmann | [1] |
| 3 | Peter Ramm | [1] |
| 4 | Maik Wiemer | [1] |
| 5 | Jürgen Wolf | [1] |