| |
| 2001 | ||
|---|---|---|
| 1 | EE | Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dusan Boroyevich, Guo-Quan Lu: Design issues of a three-dimensional packaging scheme for power modules. Microelectronics Reliability 41(2): 295-305 (2001) |
| 1 | Mike Craven | [1] |
| 2 | Shatil Haque | [1] |
| 3 | Xingsheng Liu | [1] |
| 4 | Guo-Quan Lu | [1] |
| 5 | Kalyan Siddabattula | [1] |
| 6 | Sihua Wen | [1] |