| |
| 2003 | ||
|---|---|---|
| 2 | EE | Yufeng Jin, Jun Wei, Peck Cheng Lim, Zhenfeng Wang: Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding. International Journal of Computational Engineering Science 4(2): 335-338 (2003) |
| 1 | EE | Zhenfeng Wang, G. J. Qi, Jun Wei, Peck Cheng Lim, Yufeng Jin, C. K. Wong: A Novel Wafer-Level Packaging Solution For Mems. International Journal of Computational Engineering Science 4(2): 339-342 (2003) |
| 1 | Peck Cheng Lim | [1] [2] |
| 2 | G. J. Qi | [1] |
| 3 | Zhenfeng Wang | [1] [2] |
| 4 | Jun Wei | [1] [2] |
| 5 | Chak-Kuen Wong (C. K. Wong) | [1] |