| 2006 |
|---|
| 4 | EE | N. Okada,
Chikaaki Kodama,
T. Sato,
Kunihiro Fujiyoshi:
Thermal Driven Module Placement Using Sequence-pair.
APCCAS 2006: 1871-1874 |
| 2003 |
|---|
| 3 | | K. W. Hipel,
N. Okada,
K. Fukuyama:
The internationalization of engineering education: a tale of two countries.
IEEE Transactions on Systems, Man, and Cybernetics, Part C 33(1): 137-148 (2003) |
| 2002 |
|---|
| 2 | | H. Sakakibara,
N. Okada,
D. Nakase:
The application of robustness analysis to the conflict with incomplete information.
IEEE Transactions on Systems, Man, and Cybernetics, Part C 32(1): 14-23 (2002) |
| 2001 |
|---|
| 1 | | S. Yokogawa,
N. Okada,
Y. Kakuhara,
H. Takizawa:
Electromigration Performance of Multi-level Damascene Copper Interconnects.
Microelectronics Reliability 41(9-10): 1409-1416 (2001) |
