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N. Okada

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2006
4EEN. Okada, Chikaaki Kodama, T. Sato, Kunihiro Fujiyoshi: Thermal Driven Module Placement Using Sequence-pair. APCCAS 2006: 1871-1874
2003
3 K. W. Hipel, N. Okada, K. Fukuyama: The internationalization of engineering education: a tale of two countries. IEEE Transactions on Systems, Man, and Cybernetics, Part C 33(1): 137-148 (2003)
2002
2 H. Sakakibara, N. Okada, D. Nakase: The application of robustness analysis to the conflict with incomplete information. IEEE Transactions on Systems, Man, and Cybernetics, Part C 32(1): 14-23 (2002)
2001
1 S. Yokogawa, N. Okada, Y. Kakuhara, H. Takizawa: Electromigration Performance of Multi-level Damascene Copper Interconnects. Microelectronics Reliability 41(9-10): 1409-1416 (2001)

Coauthor Index

1Kunihiro Fujiyoshi [4]
2K. Fukuyama [3]
3K. W. Hipel [3]
4Y. Kakuhara [1]
5Chikaaki Kodama [4]
6D. Nakase [2]
7H. Sakakibara [2]
8T. Sato [4]
9H. Takizawa [1]
10S. Yokogawa [1]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)