| 2005 |
|---|
| 5 | EE | Ghanshyam Nayak,
Clyde Washburn,
P. R. Mukund:
System in a Package Design of a RF Front End System Using Application Specific Reduced Order Models.
VLSI Design 2005: 878-881 |
| 2004 |
|---|
| 4 | EE | Ghanshyam Nayak,
Tejasvi Das,
T. M. Rao,
P. R. Mukund:
DREAM: A Chip-Package Co-Design Tool for RF-Mixed Signal Systems.
ISVLSI 2004: 207-210 |
| 3 | EE | Ghanshyam Nayak,
P. R. Mukund:
Chip Package Co-Design of a Heterogeneously Integrated 2.45GHz CMOS VCO using Embedded Passives in a Silicon Package.
VLSI Design 2004: 627-630 |
| 2003 |
|---|
| 2 | EE | S. Sridharan,
Ghanshyam Nayak,
P. R. Mukund:
LNA design optimization with reference to ESD protection circuitry.
ISCAS (1) 2003: 205-208 |
| 2002 |
|---|
| 1 | EE | H. Parthasarathy,
Ghanshyam Nayak,
Ponnathpur R. Mukund:
Analysis of VCO jitter in chip-package co-design.
ISCAS (3) 2002: 181-184 |
