| |
| 2001 | ||
|---|---|---|
| 1 | EE | M. K. Mazumder, S. Yamamoto, H. Maeda, J. Komori, Y. Mashiko: Mechanism of pre-annealing effect on electromigration immunity of Al-Cu line. Microelectronics Reliability 41(8): 1259-1264 (2001) |
| 1 | J. Komori | [1] |
| 2 | H. Maeda | [1] |
| 3 | Y. Mashiko | [1] |
| 4 | S. Yamamoto | [1] |