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2001 | ||
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1 | EE | M. K. Mazumder, S. Yamamoto, H. Maeda, J. Komori, Y. Mashiko: Mechanism of pre-annealing effect on electromigration immunity of Al-Cu line. Microelectronics Reliability 41(8): 1259-1264 (2001) |
1 | J. Komori | [1] |
2 | Y. Mashiko | [1] |
3 | M. K. Mazumder | [1] |
4 | S. Yamamoto | [1] |