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| 2001 | ||
|---|---|---|
| 2 | G. Dajee, N. Goldblatt, T. Lundquist, S. Kasapi, Keneth R. Wilsher: Practical, non-invasive optical probing for flip-chip devices. ITC 2001: 433-442 | |
| 1 | T. Lundquist, E. Delenia, J. Harroun, E. LeRoy, C.-C. Tsao: Ultra-Thinning of C4 Integrated Circuits for Backside Analysis during First Silicon Debug. Microelectronics Reliability 41(9-10): 1545-1549 (2001) | |
| 1 | G. Dajee | [2] |
| 2 | E. Delenia | [1] |
| 3 | N. Goldblatt | [2] |
| 4 | J. Harroun | [1] |
| 5 | S. Kasapi | [2] |
| 6 | E. LeRoy | [1] |
| 7 | C.-C. Tsao | [1] |
| 8 | Keneth R. Wilsher | [2] |