2007 | ||
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2 | Rung-Bin Lin, Da-Wei Hsu, Ming-Hsine Kuo, Meng-Chiou Wu: Reticle Exposure Plans for Multi-Project Wafers. DDECS 2007: 341-344 | |
2006 | ||
1 | EE | Rung-Bin Lin, Meng-Chiou Wu, Wei-Chiu Tseng, Ming-Hsine Kuo, Tsai-Ying Lin, Shr-Cheng Tsai: Design space exploration for minimizing multi-project wafer production cost. ASP-DAC 2006: 783-788 |
1 | Da-Wei Hsu | [2] |
2 | Rung-Bin Lin | [1] [2] |
3 | Tsai-Ying Lin | [1] |
4 | Shr-Cheng Tsai | [1] |
5 | Wei-Chiu Tseng | [1] |
6 | Meng-Chiou Wu | [1] [2] |