| |
| 2007 | ||
|---|---|---|
| 2 | EE | Ja-Myeong Koo, Seung-Boo Jung: Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package CoRR abs/0711.3306: (2007) |
| 1 | EE | Jeong-Won Yoon, H.-S. Chun, Ja-Myeong Koo, Seung-Boo Jung: Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications CoRR abs/0711.3323: (2007) |
| 1 | H.-S. Chun | [1] |
| 2 | Seung-Boo Jung | [1] [2] |
| 3 | Jeong-Won Yoon | [1] |