| 2009 |
|---|
| 3 | EE | Shenghua Liu,
Guoqiang Chen,
Tom Tong Jing,
Lei He,
Tianpei Zhang,
Robi Dutta,
Xian-Long Hong:
Substrate Topological Routing for High-Density Packages.
IEEE Trans. on CAD of Integrated Circuits and Systems 28(2): 207-216 (2009) |
| 2008 |
|---|
| 2 | EE | Shenghua Liu,
Guoqiang Chen,
Tom Tong Jing,
Lei He,
Tianpei Zhang,
Robi Dutta,
Xian-Long Hong:
Topological routing to maximize routability for package substrate.
DAC 2008: 566-569 |
| 1990 |
|---|
| 1 | EE | Robi Dutta,
Maurice Marks,
Craig Morrissey,
Ravi Rao,
Lee Sapiro:
A flexible hierarchical 3-D module assembler.
EURO-DAC 1990: 124-128 |
