Yangdong Deng

2006
6	EE	Yangdong Deng, Peng Li: Temperature-Aware Floorplanning of 3-D ICs Considering Thermally Dependent Leakage Power. J. Low Power Electronics 2(2): 177-188 (2006)
2005
5	EE	Peng Li, Yangdong Deng, Lawrence T. Pileggi: Temperature-Dependent Optimization of Cache Leakage Power Dissipation. ICCD 2005: 7-12
4	EE	Yangdong Deng, W. P. Maly: 2.5-dimensional VLSI system integration. IEEE Trans. VLSI Syst. 13(6): 668-677 (2005)
2003
3	EE	Yangdong Deng, Wojciech Maly: Physical Design of the "2.5D" Stacked System. ICCD 2003: 211-217
2002
2	EE	Jingcao Hu, Yangdong Deng, Radu Marculescu: System-Level Point-to-Point Communication Synthesis using Floorplanning Information. VLSI Design 2002: 573-579
2001
1	EE	Yangdong Deng, Wojciech Maly: Interconnect characteristics of 2.5-D system integration scheme. ISPD 2001: 171-175

Coauthor Index

1	Jingcao Hu	[2]
2	Peng Li	[5] [6]
3	W. P. Maly	[4]
4	Wojciech Maly	[1] [3]
5	Radu Marculescu	[2]
6	Lawrence T. Pileggi (Larry T. Pileggi, Lawrence T. Pillage)	[5]

Colors in the list of coauthors