| 1999 |
|---|
| 7 | EE | Joao Paulo Costa,
L. Miguel Silveira,
Mike Chou:
Efficient Techniques for Accurate Extraction and Modeling of Substrate Coupling in Mixed-Signal IC's.
DATE 1999: 396-400 |
| 6 | EE | Joao Paulo Costa,
Mike Chou,
Luis Miguel Silveira:
Efficient techniques for accurate modeling and simulation ofsubstrate coupling in mixed-signal IC's.
IEEE Trans. on CAD of Integrated Circuits and Systems 18(5): 597-607 (1999) |
| 1998 |
|---|
| 5 | EE | Mike Chou,
Jacob White:
Multilevel Integral Equation Methods for the Extraction of Substrate Coupling Parameters in Mixed-Signal IC's.
DAC 1998: 20-25 |
| 4 | EE | Joao Paulo Costa,
Mike Chou,
L. Miguel Silveira:
Efficient Techniques for Accurate Modeling and Simulation of Substrate Coupling in Mixed-Signal IC's.
DATE 1998: 892-898 |
| 1997 |
|---|
| 3 | EE | Mike Chou,
Jacob K. White:
Efficient formulation and model-order reduction for the transient simulation of three-dimensional VLSI interconnect.
IEEE Trans. on CAD of Integrated Circuits and Systems 16(12): 1454-1476 (1997) |
| 1995 |
|---|
| 2 | EE | Mike Chou,
Tom Korsmeyer,
Jacob White:
Transient Simulations of Three-Dimensional Integrated Circuit Interconnect Using a Mixed Surface-Volume Approach.
DAC 1995: 485-490 |
| 1 | EE | Mike Chou,
Jacob K. White:
Efficient reduced-order modeling for the transient simulation of three-dimensional interconnect.
ICCAD 1995: 40-44 |
