| |
| 2005 | ||
|---|---|---|
| 1 | EE | Tadanori Shimoto, Kazuhiro Baba, Koji Matsui, Jun Tsukano, Takehiko Maeda, Kenji Oyachi: Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs. Microelectronics Reliability 45(3-4): 567-574 (2005) |
| 1 | Kazuhiro Baba | [1] |
| 2 | Koji Matsui | [1] |
| 3 | Kenji Oyachi | [1] |
| 4 | Tadanori Shimoto | [1] |
| 5 | Jun Tsukano | [1] |