Clair Webb

2006
2	EE	Bryan Black, Murali Annavaram, Ned Brekelbaum, John DeVale, Lei Jiang, Gabriel H. Loh, Don McCaule, Pat Morrow, Donald W. Nelson, Daniel Pantuso, Paul Reed, Jeff Rupley, Sadasivan Shankar, John Paul Shen, Clair Webb: Die Stacking (3D) Microarchitecture. MICRO 2006: 469-479
2004
1	EE	Bryan Black, Donald Nelson, Clair Webb, Nick Samra: 3D Processing Technology and Its Impact on iA32 Microprocessors. ICCD 2004: 316-318

Coauthor Index

1	Murali Annavaram	[2]
2	Bryan Black	[1] [2]
3	Ned Brekelbaum	[2]
4	John DeVale	[2]
5	Lei Jiang	[2]
6	Gabriel H. Loh	[2]
7	Don McCaule	[2]
8	Pat Morrow	[2]
9	Donald Nelson	[1]
10	Donald W. Nelson	[2]
11	Daniel Pantuso	[2]
12	Paul Reed	[2]
13	Jeff Rupley	[2]
14	Nick Samra	[1]
15	Sadasivan Shankar	[2]
16	John Paul Shen	[2]