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2005 | ||
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2 | EE | M. H. Lin, Y. L. Lin, K. P. Chang, K. C. Su, Tahui Wang: Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment. Microelectronics Reliability 45(7-8): 1061-1078 (2005) |
2002 | ||
1 | H. K. Dai, K. C. Su: Locality Performance of Some Mesh-indexings. PDPTA 2002: 1337-1343 |
1 | K. P. Chang | [2] |
2 | H. K. Dai | [1] |
3 | M. H. Lin | [2] |
4 | Y. L. Lin | [2] |
5 | Tahui Wang | [2] |