Y. L. Lin

2005
1	EE	M. H. Lin, Y. L. Lin, K. P. Chang, K. C. Su, Tahui Wang: Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment. Microelectronics Reliability 45(7-8): 1061-1078 (2005)

Coauthor Index

1	K. P. Chang	[1]
2	M. H. Lin	[1]
3	K. C. Su	[1]
4	Tahui Wang	[1]