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M. Junack

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2001
1EED. Weber, F. Höhnsdorf, A. Hausmann, A. Klipp, Z. Stavreva, J. Herrmann, L. Bauch, M. Junack, H. Neef, M. Nichterwitz, S. Finsterbusch: Impact of substituting SiO2 ILD by low k materials into AlCu RIE metallization. Microelectronics Reliability 41(7): 1081-1083 (2001)

Coauthor Index

1L. Bauch [1]
2S. Finsterbusch [1]
3A. Hausmann [1]
4J. Herrmann [1]
5F. Höhnsdorf [1]
6A. Klipp [1]
7H. Neef [1]
8M. Nichterwitz [1]
9Z. Stavreva [1]
10D. Weber [1]

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