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| 2001 | ||
|---|---|---|
| 1 | EE | D. Weber, F. Höhnsdorf, A. Hausmann, A. Klipp, Z. Stavreva, J. Herrmann, L. Bauch, M. Junack, H. Neef, M. Nichterwitz, S. Finsterbusch: Impact of substituting SiO2 ILD by low k materials into AlCu RIE metallization. Microelectronics Reliability 41(7): 1081-1083 (2001) |
| 1 | L. Bauch | [1] |
| 2 | A. Hausmann | [1] |
| 3 | J. Herrmann | [1] |
| 4 | F. Höhnsdorf | [1] |
| 5 | M. Junack | [1] |
| 6 | A. Klipp | [1] |
| 7 | H. Neef | [1] |
| 8 | M. Nichterwitz | [1] |
| 9 | Z. Stavreva | [1] |
| 10 | D. Weber | [1] |