| |
| 2004 | ||
|---|---|---|
| 3 | James W. Joyner, Payman Zarkesh-Ha, James D. Meindl: Global interconnect design in a three-dimensional system-on-a-chip. IEEE Trans. VLSI Syst. 12(4): 367-372 (2004) | |
| 2001 | ||
| 2 | EE | James W. Joyner, Raguraman Venkatesan, Payman Zarkesh-Ha, Jeffrey A. Davis, James D. Meindl: Impact of three-dimensional architectures on interconnects in gigascale integration. IEEE Trans. VLSI Syst. 9(6): 922-928 (2001) |
| 2000 | ||
| 1 | EE | James W. Joyner, Payman Zarkesh-Ha, Jeffrey A. Davis, James D. Meindl: Vertical pitch limitations on performance enhancement in bonded three-dimensional interconnect architectures. SLIP 2000: 123-127 |
| 1 | Jeffrey A. Davis | [1] [2] |
| 2 | James D. Meindl | [1] [2] [3] |
| 3 | Raguraman Venkatesan | [2] |
| 4 | Payman Zarkesh-Ha | [1] [2] [3] |