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2009 | ||
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6 | EE | Basab Datta, Wayne P. Burleson: Low-power, process-variation tolerant on-chip thermal monitoring using track and hold based thermal sensors. ACM Great Lakes Symposium on VLSI 2009: 145-148 |
5 | EE | Basab Datta, Wayne Burleson: On temperature planarization effect of copper dummy fills in deep nanometer technology. ISQED 2009: 494-499 |
4 | EE | Basab Datta, Wayne Burleson: Temperature effects on energy optimization in sub-threshold circuit design. ISQED 2009: 680-685 |
2008 | ||
3 | EE | Basab Datta, Wayne Burleson: Collaborative sensing of on-chip wire temperatures using interconnect based ring oscillators. ACM Great Lakes Symposium on VLSI 2008: 41-46 |
2 | EE | Basab Datta, Wayne P. Burleson: Temperature measurement in Content Addressable Memory cells using bias-controlled VCO. SoCC 2008: 147-150 |
2007 | ||
1 | EE | Basab Datta, Wayne P. Burleson: Low power on-chip thermal sensors based on wires. VLSI-SoC 2007: 258-263 |
1 | Wayne P. Burleson (Wayne Burleson) | [1] [2] [3] [4] [5] [6] |