2007 | ||
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2 | EE | Hao Yu, Chunta Chu, Lei He: Off-chip Decoupling Capacitor Allocation for Chip Package Co-Design. DAC 2007: 618-621 |
1 | EE | Chunta Chu, Xinyi Zhang, Lei He, Tong Jing: Temperature aware microprocessor floorplanning considering application dependent power load. ICCAD 2007: 586-589 |
1 | Lei He | [1] [2] |
2 | Tong Jing | [1] |
3 | Hao Yu | [2] |
4 | Xinyi Zhang | [1] |