O. Boissière

2005
1	EE	U. Weber, M. Schumacher, J. Lindner, O. Boissière, P. Lehnen, S. Miedl, P. K. Baumann, G. Barbar, C. Lohe, T. McEntee: AVD® technology for deposition of next generation devices. Microelectronics Reliability 45(5-6): 945-948 (2005)

Coauthor Index

1	G. Barbar	[1]
2	P. K. Baumann	[1]
3	P. Lehnen	[1]
4	J. Lindner	[1]
5	C. Lohe	[1]
6	T. McEntee	[1]
7	S. Miedl	[1]
8	M. Schumacher	[1]
9	U. Weber	[1]