| |
| 2005 | ||
|---|---|---|
| 1 | EE | U. Weber, M. Schumacher, J. Lindner, O. Boissière, P. Lehnen, S. Miedl, P. K. Baumann, G. Barbar, C. Lohe, T. McEntee: AVD® technology for deposition of next generation devices. Microelectronics Reliability 45(5-6): 945-948 (2005) |
| 1 | P. K. Baumann | [1] |
| 2 | O. Boissière | [1] |
| 3 | P. Lehnen | [1] |
| 4 | J. Lindner | [1] |
| 5 | C. Lohe | [1] |
| 6 | T. McEntee | [1] |
| 7 | S. Miedl | [1] |
| 8 | M. Schumacher | [1] |
| 9 | U. Weber | [1] |