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P. K. Baumann

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2005
1EEU. Weber, M. Schumacher, J. Lindner, O. Boissière, P. Lehnen, S. Miedl, P. K. Baumann, G. Barbar, C. Lohe, T. McEntee: AVD® technology for deposition of next generation devices. Microelectronics Reliability 45(5-6): 945-948 (2005)

Coauthor Index

1G. Barbar [1]
2O. Boissière [1]
3P. Lehnen [1]
4J. Lindner [1]
5C. Lohe [1]
6T. McEntee [1]
7S. Miedl [1]
8M. Schumacher [1]
9U. Weber [1]

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