2005 | ||
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1 | EE | U. Weber, M. Schumacher, J. Lindner, O. Boissière, P. Lehnen, S. Miedl, P. K. Baumann, G. Barbar, C. Lohe, T. McEntee: AVD® technology for deposition of next generation devices. Microelectronics Reliability 45(5-6): 945-948 (2005) |
1 | G. Barbar | [1] |
2 | O. Boissière | [1] |
3 | P. Lehnen | [1] |
4 | J. Lindner | [1] |
5 | C. Lohe | [1] |
6 | T. McEntee | [1] |
7 | S. Miedl | [1] |
8 | M. Schumacher | [1] |
9 | U. Weber | [1] |