| |
| 2007 | ||
|---|---|---|
| 2 | EE | Cemal Basaran, Minghui Lin, Shidong Li: Computational simulation of electromigration induced damage in copper interconnects. SCSC 2007: 261-268 |
| 1 | EE | Cemal Basaran, Juan Gomez, Minghui Lin, Shidong Li: Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging. SCSC 2007: 269-275 |
| 1 | Cemal Basaran | [1] [2] |
| 2 | Juan Gomez | [1] |
| 3 | Shidong Li | [1] [2] |