Juan Gomez
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2007
1
EE
Cemal Basaran
, Juan Gomez,
Minghui Lin
,
Shidong Li
: Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging.
SCSC 2007
: 269-275
Coauthor
Index
1
Cemal Basaran
[
1
]
2
Shidong Li
[
1
]
3
Minghui Lin
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
