| 2003 |
|---|
| 3 | EE | Michael X. Wang,
Katsuharu Suzuki,
Wayne Wei-Ming Dai:
Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform.
ISQED 2003: 229-234 |
| 2000 |
|---|
| 2 | EE | Michael X. Wang,
Katsuharu Suzuki,
Wayne Wei-Ming Dai,
Yee L. Low,
Kevin J. O'Conner,
King L. Tai:
Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology.
ASP-DAC 2000: 205-210 |
| 1 | EE | Katsuharu Suzuki,
Michael X. Wang,
Zhao Fang,
Wayne Wei-Ming Dai:
Design of C++ Class Library and Bit-Serial Compiler for Variable-Precision Datapath Synthesis on Adaptive Computing Systems.
FCCM 2000: 339-340 |
