King L. Tai

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3EEKing L. Tai: System-in-package (SIP): challenges and opportunities. ASP-DAC 2000: 191-196
2EEMichael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming Dai, Yee L. Low, Kevin J. O'Conner, King L. Tai: Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology. ASP-DAC 2000: 205-210
1EERobert C. Frye, King L. Tai, Maureen Y. Lau, Thaddeus J. Gabara: Trends in Silicon-On-Silicon Multichip Modules. IEEE Design & Test of Computers 10(4): 8-17 (1993)

Coauthor Index

1Wayne Wei-Ming Dai [2]
2Robert C. Frye [1]
3Thaddeus J. Gabara [1]
4Maureen Y. Lau [1]
5Yee L. Low [2]
6Kevin J. O'Conner [2]
7Katsuharu Suzuki [2]
8Michael X. Wang [2]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)