King L. Tai

2000
3	EE	King L. Tai: System-in-package (SIP): challenges and opportunities. ASP-DAC 2000: 191-196
2	EE	Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming Dai, Yee L. Low, Kevin J. O'Conner, King L. Tai: Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology. ASP-DAC 2000: 205-210
1993
1	EE	Robert C. Frye, King L. Tai, Maureen Y. Lau, Thaddeus J. Gabara: Trends in Silicon-On-Silicon Multichip Modules. IEEE Design & Test of Computers 10(4): 8-17 (1993)

Coauthor Index

1	Wayne Wei-Ming Dai	[2]
2	Robert C. Frye	[1]
3	Thaddeus J. Gabara	[1]
4	Maureen Y. Lau	[1]
5	Yee L. Low	[2]
6	Kevin J. O'Conner	[2]
7	Katsuharu Suzuki	[2]
8	Michael X. Wang	[2]

Colors in the list of coauthors