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A. Vythilingam

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2005
1EEK. C. Lee, A. Vythilingam, P. Alpern: A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages. Microelectronics Reliability 45(9-11): 1668-1671 (2005)

Coauthor Index

1P. Alpern [1]
2K. C. Lee [1]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)