P. Alpern
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2005
1
EE
K. C. Lee
,
A. Vythilingam
, P. Alpern: A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages.
Microelectronics Reliability 45
(9-11): 1668-1671 (2005)
Coauthor
Index
1
K. C. Lee
[
1
]
2
A. Vythilingam
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)