Da-Yuan Shih

2005
2	EE	Sung K. Kang, Paul Lauro, Da-Yuan Shih, Donald W. Henderson, Karl J. Puttlitz: Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications. IBM Journal of Research and Development 49(4-5): 607-620 (2005)
1	EE	Peter A. Gruber, Luc Bélanger, Guy P. Brouillette, David H. Danovitch, Jean-Luc Landreville, David T. Naugle, Valerie A. Oberson, Da-Yuan Shih, Chris L. Tessler, Michel R. Turgeon: Low-cost wafer bumping. IBM Journal of Research and Development 49(4-5): 621-640 (2005)

Coauthor Index

1	Luc Bélanger	[1]
2	Guy P. Brouillette	[1]
3	David H. Danovitch	[1]
4	Peter A. Gruber	[1]
5	Donald W. Henderson	[2]
6	Sung K. Kang	[2]
7	Jean-Luc Landreville	[1]
8	Paul Lauro	[2]
9	David T. Naugle	[1]
10	Valerie A. Oberson	[1]
11	Karl J. Puttlitz	[2]
12	Chris L. Tessler	[1]
13	Michel R. Turgeon	[1]

Colors in the list of coauthors