| |
| 2005 | ||
|---|---|---|
| 1 | EE | Peter A. Gruber, Luc Bélanger, Guy P. Brouillette, David H. Danovitch, Jean-Luc Landreville, David T. Naugle, Valerie A. Oberson, Da-Yuan Shih, Chris L. Tessler, Michel R. Turgeon: Low-cost wafer bumping. IBM Journal of Research and Development 49(4-5): 621-640 (2005) |
| 1 | Guy P. Brouillette | [1] |
| 2 | David H. Danovitch | [1] |
| 3 | Peter A. Gruber | [1] |
| 4 | Jean-Luc Landreville | [1] |
| 5 | David T. Naugle | [1] |
| 6 | Valerie A. Oberson | [1] |
| 7 | Da-Yuan Shih | [1] |
| 8 | Chris L. Tessler | [1] |
| 9 | Michel R. Turgeon | [1] |