| |
| 2005 | ||
|---|---|---|
| 1 | EE | Sung K. Kang, Paul Lauro, Da-Yuan Shih, Donald W. Henderson, Karl J. Puttlitz: Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications. IBM Journal of Research and Development 49(4-5): 607-620 (2005) |
| 1 | Donald W. Henderson | [1] |
| 2 | Sung K. Kang | [1] |
| 3 | Karl J. Puttlitz | [1] |
| 4 | Da-Yuan Shih | [1] |