| |
| 2005 | ||
|---|---|---|
| 1 | EE | Ji-hyuk Lim, Keon Kuk, Seung-joo Shin, Seog-soon Baek, Young-jae Kim, Jong-woo Shin, Yong-soo Oh: Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation. Microelectronics Reliability 45(3-4): 473-478 (2005) |
| 1 | Seog-soon Baek | [1] |
| 2 | Young-jae Kim | [1] |
| 3 | Keon Kuk | [1] |
| 4 | Ji-hyuk Lim | [1] |
| 5 | Jong-woo Shin | [1] |
| 6 | Seung-joo Shin | [1] |