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2005 | ||
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1 | EE | Ji-hyuk Lim, Keon Kuk, Seung-joo Shin, Seog-soon Baek, Young-jae Kim, Jong-woo Shin, Yong-soo Oh: Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation. Microelectronics Reliability 45(3-4): 473-478 (2005) |
1 | Seog-soon Baek | [1] |
2 | Young-jae Kim | [1] |
3 | Ji-hyuk Lim | [1] |
4 | Yong-soo Oh | [1] |
5 | Jong-woo Shin | [1] |
6 | Seung-joo Shin | [1] |