1996 |
4 | EE | Toshifumi Honda,
Yukio Matsuyama,
Hisae Yamamura,
Hideaki Sasazawa,
Takanori Ninomiya,
Ludwig Listl,
Anton Schick,
Richard Schneider:
Automated Visual Inspection Algorithm for Solder Joint of Surface Mount Devices Based on Three Dimensional Shape Analysis.
MVA 1996: 261-266 |
1994 |
3 | EE | Toshifumi Honda,
Hisae Yamamura,
Syouji Ueda,
Minoru Kawabata,
Takanori Ninomiya:
Automated Inspection System for Electronic Devices Mounted on Printed Circuit Boards Using Light-Section Method.
MVA 1994: 575-578 |
1992 |
2 | EE | Takashi Hiroi,
Kazushi Yoshimura,
Takanori Ninomiya,
Toshimitsu Hamada,
Yasuo Nakagawa,
Shigeki Mio,
Kouichi Karasaki,
Hideaki Sasaki:
Development of Solder Joint Inspection Method Using Air Stimulation Speckle Vibration Detection Method and Fluorescence Detection Method.
MVA 1992: 429-434 |
1990 |
1 | EE | Takanori Ninomiya,
Yasuo Nakagawa:
Precise Position Detection of a Mesh-Backed Printing Screen Based on the Smallest Enclosing Circle Detection.
MVA 1990: 23-26 |