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Huamao Lin

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2003
1EEWenjiang Zeng, Huamao Lin, Xiaolin Zhang, Ramasamy Chockalingam, Wee Chong Heng, Sangki Hong, Narayanan Balasubramanian: Effects Of Wafer Bonding And Thinning Processes On Electrical Performance Of Mos Devices. International Journal of Computational Engineering Science 4(2): 323-326 (2003)

Coauthor Index

1Narayanan Balasubramanian [1]
2Ramasamy Chockalingam [1]
3Wee Chong Heng [1]
4Sangki Hong [1]
5Wenjiang Zeng [1]
6Xiaolin Zhang [1]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)