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| 2003 | ||
|---|---|---|
| 1 | EE | Wenjiang Zeng, Huamao Lin, Xiaolin Zhang, Ramasamy Chockalingam, Wee Chong Heng, Sangki Hong, Narayanan Balasubramanian: Effects Of Wafer Bonding And Thinning Processes On Electrical Performance Of Mos Devices. International Journal of Computational Engineering Science 4(2): 323-326 (2003) |
| 1 | Narayanan Balasubramanian | [1] |
| 2 | Wee Chong Heng | [1] |
| 3 | Sangki Hong | [1] |
| 4 | Huamao Lin | [1] |
| 5 | Wenjiang Zeng | [1] |
| 6 | Xiaolin Zhang | [1] |