| |
| 2000 | ||
|---|---|---|
| 2 | EE | Danqing Chen, Erhong Li, Elyse Rosenbaum, Sung-Mo Kang: Interconnect thermal modeling for accurate simulation of circuittiming and reliability. IEEE Trans. on CAD of Integrated Circuits and Systems 19(2): 197-205 (2000) |
| 1999 | ||
| 1 | EE | Danqing Chen, Erhong Li, Elyse Rosenbaum, Sung-Mo Kang: Interconnect thermal modeling for determining design limits on current density. ISPD 1999: 172-178 |
| 1 | Danqing Chen | [1] [2] |
| 2 | Sung-Mo Kang | [1] [2] |
| 3 | Elyse Rosenbaum | [1] [2] |