| |
| 2005 | ||
|---|---|---|
| 2 | EE | Stephen L. Buchwalter, Peter J. Brofman, Claudius Feger, Michael A. Gaynes, Kang-Wook Lee, Luis J. Matienzo, David L. Questad: Effects of mechanical stress and moisture on packaging interfaces. IBM Journal of Research and Development 49(4-5): 663-676 (2005) |
| 1994 | ||
| 1 | Kang-Wook Lee, Alfred Viehbeck: Wet-process surface modification of dielectric polymers: Adhesion enhancement and metallization. IBM Journal of Research and Development 38(4): 457-474 (1994) | |
| 1 | Peter J. Brofman | [2] |
| 2 | Stephen L. Buchwalter | [2] |
| 3 | Claudius Feger | [2] |
| 4 | Michael A. Gaynes | [2] |
| 5 | Luis J. Matienzo | [2] |
| 6 | David L. Questad | [2] |
| 7 | Alfred Viehbeck | [1] |