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2005 | ||
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1 | EE | Stephen L. Buchwalter, Peter J. Brofman, Claudius Feger, Michael A. Gaynes, Kang-Wook Lee, Luis J. Matienzo, David L. Questad: Effects of mechanical stress and moisture on packaging interfaces. IBM Journal of Research and Development 49(4-5): 663-676 (2005) |
1 | Peter J. Brofman | [1] |
2 | Claudius Feger | [1] |
3 | Michael A. Gaynes | [1] |
4 | Kang-Wook Lee | [1] |
5 | Luis J. Matienzo | [1] |
6 | David L. Questad | [1] |