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2006 | ||
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1 | EE | M. Capobianchi, V. Labay, F. Shi, G. Mizushima: Simulating the Electrical Behavior of Integrated Circuit Devices in the Presence of Thermal Interactions. IEEE Trans. on CAD of Integrated Circuits and Systems 25(10): 2231-2241 (2006) |
1 | M. Capobianchi | [1] |
2 | G. Mizushima | [1] |
3 | F. Shi | [1] |