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| 2006 | ||
|---|---|---|
| 1 | EE | M. Capobianchi, V. Labay, F. Shi, G. Mizushima: Simulating the Electrical Behavior of Integrated Circuit Devices in the Presence of Thermal Interactions. IEEE Trans. on CAD of Integrated Circuits and Systems 25(10): 2231-2241 (2006) |
| 1 | V. Labay | [1] |
| 2 | G. Mizushima | [1] |
| 3 | F. Shi | [1] |