| |
| 1998 | ||
|---|---|---|
| 2 | EE | Keith K. H. Wong, Suryanarayana Kaja, Patrick W. DeHaven: Metallization by plating for high-performance multichip modules. IBM Journal of Research and Development 42(5): 587-596 (1998) |
| 1 | EE | Eugene J. O'Sullivan, Alejandro G. Schrott, Milan Paunovic, Carlos J. Sambucetti, Jeffrey R. Marino, Philip J. Bailey, Suryanarayana Kaja, Krystyna W. Semkow: Electrolessly deposited diffusion barriers for microelectronics. IBM Journal of Research and Development 42(5): 607-620 (1998) |
| 1 | Philip J. Bailey | [1] |
| 2 | Patrick W. DeHaven | [2] |
| 3 | Jeffrey R. Marino | [1] |
| 4 | Eugene J. O'Sullivan | [1] |
| 5 | Milan Paunovic | [1] |
| 6 | Carlos J. Sambucetti | [1] |
| 7 | Alejandro G. Schrott | [1] |
| 8 | Krystyna W. Semkow | [1] |
| 9 | Keith K. H. Wong | [2] |