Keith K. H. Wong
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1998
1
EE
Keith K. H. Wong,
Suryanarayana Kaja
,
Patrick W. DeHaven
: Metallization by plating for high-performance multichip modules.
IBM Journal of Research and Development 42
(5): 587-596 (1998)
Coauthor
Index
1
Patrick W. DeHaven
[
1
]
2
Suryanarayana Kaja
[
1
]
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Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)