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Keith K. H. Wong

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1998
1EEKeith K. H. Wong, Suryanarayana Kaja, Patrick W. DeHaven: Metallization by plating for high-performance multichip modules. IBM Journal of Research and Development 42(5): 587-596 (1998)

Coauthor Index

1Patrick W. DeHaven [1]
2Suryanarayana Kaja [1]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)